National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| AM3705DM | 27014 | A | E | 8 | 4 | TX | ||
| DG501AP/883B-2 | 17856 | A | 5 | 9 | 6 | TX | ||
| DG501AP/883C | 17856 | A | 5 | 9 | 6 | TX | ||
| DG501AP-2 | 17856 | A | C | 1 | 5 | TX | A5 | |
| DG501BP | 17856 | A | C | 1 | 6 | ZZ | AC | |
| 351-7449-021 | 13499 | A | C | 1 | 6 | ZZ | AC | |
| 730-0045 | 22818 | A | C | 1 | 6 | TX | AF | |
| DMS 91137B | 16236 | A | 5 | 9 | 9 | TX | ||
| DG501AP-4 | 17856 | A | 5 | 9 | 3 | TX | ||
| 900348 | 33827 | A | 5 | 2 | 1 | TX | ||
| 0213-1-1150-2 | 15942 | F | 3 | 2 | 1 | TX | ||
| 310429P2 | 94117 | A | E | 8 | A | TX | ||
| DG501AP/883B | 17856 | A | 5 | 9 | 6 | ZZ | ||
| AM3705D883B | 27014 | A | E | 8 | 4 | TX |
CAGE Information
| Code | Company |
|---|---|
| 13499 | ROCKWELL COLLINS INC. DBA GOVERNMENT |
| 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| 17856 | SILICONIX INCORPORATED DIV SILICONIX |
| 22818 | HUBBELL HARVEY INC PULSECOM DIV |
| 16236 | DLA LAND AND MARITIME |
| 33827 | BAE SYSTEMS INTEGRATED DEFENSE SOLUT |
| 15942 | USACECOM INTELLIGENCE ELECTRONIC WAR |
| 94117 | BAE SYSTEMS INFORMATION AND ELECTRON |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND MONOLITHIC AND W/ENABLE |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 1500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 2500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 15942-0213-1-1150-2 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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,
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