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Part Number

Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY

Definition:

A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.

CAGE Information

Code Company
60395 XICOR INC

Federal Supply Class

Title

MICROCIRCUITS, ELECTRONIC

Inclusions:

INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.

Exclusions:

EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.

Characteristics (Decoded)

MRC Requirements Statement Clear Text Reply
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
TTQY TERMINAL TYPE AND QUANTITY 32 LEADLESS
CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CQSJ INCLOSURE MATERIAL CERAMIC
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE
ADAU BODY HEIGHT 0.085 INCHES MAXIMUM
CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD
CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK
CZER MEMORY DEVICE TYPE RAM
ADAT BODY WIDTH 0.458 INCHES MAXIMUM
CZEQ TIME RATING PER CHACTERISTIC 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
ADAQ BODY LENGTH 0.560 INCHES MAXIMUM
CQZP INPUT CIRCUIT PATTERN 21 INPUT
CWSG TERMINAL SURFACE TREATMENT SOLDER

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